B T S
B T S
B T S
B T S
Broad Tech System, Inc.
Provide Equipment & Engineering Service to Semiconductor Industry
www.broadtechsystem.com
Applied Material Prevision 5000
P5000 Processes

- ASP

- Sputter Etch

- Oxide Etch

- Poly Etch

- Nitride Etch

- Metal Etch

- TEOS, Doped / Undoped

- WCVD

- WSiX

- SACVD
P5000 Chambers

- ASP

- Mark II

- MxP, MxP+

- MxP+ Poly

- WxP

- DxZ

- WxZ

- Universal CVD

- WCVD

- Orienter Chamber
P: 909-923-2666
F: 909-923-2699
sales@broadtechsystem.com

Ontario, CA 91761 USA
Endura PVD Processes

-
Standard Aluminum (Al)

- Planarized Hot Aluminum
(HTHU)

- Standard Titanium (Ti)

- Coherent Titanium
(Coh Ti)

- Dedicated Titanium
Nitride (TiN)

- Titanium / Titanium
Nitride (TTN)

- Coherent Titanium &  
Titanium Nitride (Coh TTN)

- Titanium Tungsten (TiW)

- Tungsten (W)
Endura Chambers

-
Standard Body Chamber

- Wide Body PVD Chamber

- Water Cooled PVD Chamber

- Paste Chamber (Ch-5)

- Preclean I / II chamber

- Orienter / Degas Chamber

- PVD Degas Chamber

- Vectra IMP
Applied Material Endura 5500
Applied Material Centura 5200
Centura Processes

- ASP

- Sputter Etch

- Oxide Etch

- Poly Etch

- Nitride Etch

- DPS Poly or Metal Etch

- HDP-CVD

- TEOS, Doped / Undoped

- WCVD

- WSiX

- RTP

- PVD

- SACVD
Centura Chambers

- ASP+

- Sputter Etch

- MxP

- MxP+

- eMxP+ and Super eMxP+

- DPS, R0/R1

- WxP

- DxZ

- WxZ

- HDP

- RTP (Mod 1), RTPxe

- Universal CVD

- Preclean II chamber

- Orienter / Degas

- Single / Multi Slot Cool Down
Varian Sputtering System
3290 system sets the pace for state-of-the-art wafer sputtering,
this new system is based upon the widely accepted and
field-proven design of the acclaimed 3280. It provides
significant improvements for even greater performance and
reliability

System Features:

- Up to three Quantum deposition stations for extended
versatility.

- Combined Preheat and RF etch station for sequential or
simultaneous    wafer preconditioning.

- Vacuum Isolated Preprocess Station (VIPS) for multi-level   
metal applications.

- ViaFiTM for 100% step coverage with aluminum alloy films.

- SECS II host computer interface software.

- Multipass software permits sequential layering of dissimilar
metals for hillock control.
Perkin Elmer 4400 Sputtering System
PE 4400 Series of RF Plasma systems for sputtering and
etching reflect an advanced design concept based on a high
capacity load lock that permits wafer loading without breaking
vacuum in the process chamber

Including:
- 3 source system 2/Deposition and 1/RF DC bias
- Main processing system with load lock
- Capable of large substrate pallet
- Auto pumpdown control
- Auto load lock and pallet control
- Sequential deposit of up to 4 films
- Gas control system
- 3 gas capability
- Pressure control
- CTI Cryo pump with compressor
- RF and DC sputter deposition capability
- Capable of round targets
- 8" round cathodes
- Water cooled substrate holder
- Table rotation adjustable from 1 to 10 RPM
- RF plasma products generator
- Turbo pumped process chamber
PE 4400 Series of RF Plasma systems for sputtering and
etching reflect an advanced design concept based on a high
capacity load lock that permits wafer loading without breaking
vacuum in the process chamber

Including:
- 3 source system 2/Deposition and 1/RF DC bias
- Main processing system with load lock
- Capable of large substrate pallet
- Auto pumpdown control
- Auto load lock and pallet control
- Sequential deposit of up to 4 films
- Gas control system
- 3 gas capability
- Pressure control
- CTI Cryo pump with compressor
- RF and DC sputter deposition capability
- Capable of round targets
- 8" round cathodes
- Water cooled substrate holder
- Table rotation adjustable from 1 to 10 RPM
- RF plasma products generator
- Turbo pumped process chamber
Looking for equipment ? Please contact us : sales@broadtechsystem.com
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